Quality Control Operator, Graveyard Shift

Salary is dependent on experience and education

JOB DESCRIPTION

Job Code:

Reports To: Quality Control Production Manager

Department Name: 196 – Quality Control

FLSA Status:Non-Exempt

Graveyard shift: Monday-Friday 10:00pm-6:30am

POSITION SUMMARY

Use microscopic equipment for 8+ hours per day to perform a visual inspection of die and other components by following standard and customized requirements per customer requests. Categorize defects following standard or customized specifications. Review and approve operator support requests, perform quality control rounds, identify defective or non-conforming products, verify in-progress and completed operator paperwork, and review complete steps within a project’s production cycle.

KEY RESPONSIBILITIES/ESSENTIAL FUNCTIONS INCLUDE

All Levels:

  • Comply with safety conditions and priorities.
  • Communicate repeatable QC findings to the Quality Control Production Manager.
  • Be willing to work overtime as needed to ensure that Integra meets and exceeds customers’ expectations.
  • Flexibility to perform other job duties as assigned.

Level 1:

  • Count and verify production lot quantities versus existing computer entries and paperwork.
  • Learn the operation of equipment to adequately perform job functions.
  • Able to work in a fast-paced environment and perform repetitive workloads.

Level 2: Must be proficient in one or more of the functions below.

Level 3: Must be proficient in two or more of the functions below.

Level 4: Must be proficient in three or more of the functions below.

  • IQA Using microscope for 90% of the time, and may use other equipment:
    1. (IQA) Incoming and Outgoing Wafer and Dies.
    2. (IQA) Incoming and Outgoing Materials and Substrate.
    3. Measuring Accept and Reject Defects.
  • 2nd Op
    1. Select a random sample using a 0.65% AQL and visually inspect each die under a microscope.
    2. Compare the number of rejects to the accept/reject criteria of the AQL table.
    3. Accept lots and proceed to the next operation shown on the traveler.
    4. Record inspection results on the traveler and 2nd Optical Summary Report.
    5. Perform 100% Die Orientation Monitor.
    6. Transfer inspected dice from the mother traveler to individual job travelers for Assembly.
    7. Review paperwork entries on Traveler and Reject Summaries.
  • 3rd Optical
    1. Proficient with High-Power and Low Power microscopes.
    2. Perform inspection and rejection criteria related to Condition A for QML Class S (V) and Condition B for QML Class B (Q) Devices.
    3. Perform Visual examination of the die, Solder bump and die sidewall inspection.
    4. Record all Third Optical rejects and sign-off traveler.
  • 4th Optical
    1. Packages: Identify all the package defects.
    2. Leads/Solder Ball: Identify the Leads and Solder ball defects.
    3. Seal/Fill: Identify the Seal/Fill defects marks.
    4. Identify mark defects and all other specified defects.
  • QFN/DFN
    1. Inspect QFN/DFN Lead Frames purchased by Integra Technologies. Review the CoC as part of the IQA inspection for compliance with acceptance criteria.
    2. Read and understand the Lead Frame Drawing.
    3. Document the IQA inspection results.
    4. Check First Article lead frame shipments.
  • Final QA
    1. Ensure that products shipped meet customer specifications.
    2. Completely and accurately fill out all respective documentation including travelers, process control data, and logs.
    3. Verify the correct quantity needed to be shipped. Ensure that all excess materials are returned to the customer if specified.

JOB REQUIREMENTS INCLUDE

Education: High school diploma or equivalent required.

Experience:

  • All Levels: Experience with AQL sampling and criteria for accept an reject for semiconductor IC units.
  • Level 1: Minimum of one year in the semiconductor industry plus one year using a microscope.
  • Level 2: 1-2 years in semiconductor QA role plus 1-2 years using a microscope.
  • Level 3: 3-5 years in semiconductor QA role plus 3-5 years using a microscope.
  • Level 4: 6+ years in semiconductor QA role plus 6+ years using a microscope.

Knowledge/Skills:

  • Effectively and efficiently utilize Microsoft Office and other computer products and programs.
  • Utilize effective written and verbal communication skills to achieve the required results.
  • Effectively communicate with internal and external customers.
  • Ability to accurately track, enter, and maintain data.
  • Ability to interpret a variety of technical instructions in written, oral, diagram, or schedule form.

SUPERVISORY RESPONSIBILITIES

Total Number of Employees Directly Supervising: _0_

Number of Subordinate Supervisors Reporting to Position: _0_

This job description is intended to describe the general nature and level of work being performed. This is not intended to be an all-inclusive list of responsibilities, duties, skills required of employees so classified.

In addition, this is not an employment contract and should not be construed or interpreted as creating an implied or expressed guarantee of continued employment. The employment relationship at Integra Technologies Inc is by mutual consent (Employment at Will).

PHYSICAL REQUIREMENTS INCLUDE

In an average workday, employee must (check one frequency for each task):

Task

None

Occasional

Frequent

Constant

Stand

•☒
•Walk

•☒
•Sit
•☒

•Bend/stoop


•☒

Climb
•☒

•Reach above shoulders
•☒

•Squat/crouch/kneel

•☒
•Push/pull

•☒
•Lift

•☒
•Usual amount
• <10 lbs ☒ 11-25 lbs
• 26-50 lbs
• 51+ lbs

Carry
•☒

•Usual amount

☒ <10 lbs
• 11-25 lbs
• 26-50 lbs
• 51+ lbs

Employee must use hands for repetitive action such as (please check all):

Task

Right

Hand

Left

Hand

Simple grasping

☒ Yes
• No

☒ Yes
• No

Firm grasping

☒ Yes
• No

☒ Yes
• No

Fine manipulation

☒ Yes
• No

☒ Yes
• No

WORKING CONDITIONS INCLUDE

In an average workday, employee is exposed to (check one frequency for each task):

Task

None

Occasional

Frequent

Constant

General shop conditions

•☒
•General office environment
•☒

•Humid, extreme hot/cold temps (non-weather)
•☒

•Outdoor weather conditions




•Fumes or airborne particles
•☒

•Fluorescent lights

•☒
•Moving, mechanical parts
•☒

•Toxic chemicals




•Loud noise intensity levels
•☒

•Risk of electrical shock
•☒

•Travel for job



••

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