Tenstorrent is leading the industry on cutting-edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency. With AI redefining the computing paradigm, solutions must evolve to unify innovations in software models, compilers, platforms, networking, and semiconductors. Our diverse team of technologists have developed a high performance RISC-V CPU from scratch, and share a passion for AI and a deep desire to build the best AI platform possible. We value collaboration, curiosity, and a commitment to solving hard problems. We are growing our team and looking for contributors of all seniorities.
(role can be based in Austin, TX, Toronto, Canada or Santa Clara, CA)
As a Semiconductor Packaging Technologist/Integrator, you will be a part of the team that defines the packaging roadmap to ensure seamless integration between silicon, packaging, and systems. You will monitor HPC/AI emerging technologies and market demands to guide our packaging strategies. You will work collaborating closely with cross-functional teams, suppliers, and partners. You will develop comprehensive cost models, initiate requests for quotes (RFQs), and make informed packaging decisions that balance performance, cost, and reliability.
Requirement
Minimum 5 years of experience in semiconductor packaging
Experience with 2.5D and 3D packaging and chiplets is an asset
Experience with package design for high-power products is an asset
Ability to work independently in a rapidly evolving environment
Ability to collaborate effectively with cross-functional teams, suppliers, and partners.
Ability to make decisions with incomplete or ambiguous data
Compensation for all engineers at Tenstorrent ranges from $100k – $500k including base and variable compensation targets. Experience, skills, education, background and location all impact the actual offer made.